Wafer cleaving is a must-have skill for semiconductor process engineers and researchers. Among all the different wafer cleaving methods that we've used/seen, the one demonstrated here shows the best results in terms of least particles on the final sample and least wear and tear of the diamond scribe.
This is the Si wafer that we are going to cleave. 100mm, 525um thick, SSP, <100>.
On a <100> silicon wafer, it is possible to cleave at 90deg prependicular to those flats (P type).
Home | Products | Inquiry | Resources | Contact | Disclaimer | Sitemap
Copy Right: PrimeWafers.com. All rights reserved.